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Supermicro Expands End-to-End DCBBS Liquid Cooling Portfolio with Rear Door Heat Exchangers for High-Density AI and HPC Infrastructure

Supermicro Expands End-to-End DCBBS Liquid Cooling Portfolio with Rear Door Heat Exchangers for High-Density AI and HPC Infrastructure

Jul 16, 2026

San Jose (California) [US], July 16: Super Micro Computer, Inc. (NASDAQ: SMCI), an AI, Enterprise, Storage, and 5G/Edge IT Total Solution Provider, featuring Data Center Building Block Solutions® (DCBBS), today announced the expansion of its Rear Door Heat Exchanger (RDHx) portfolio, further strengthening its end-to-end liquid cooling solutions for high-density AI and HPC infrastructure. As a key component of DCBBS, the expanded RDHx portfolio offers flexible cooling capacities, providing data center operators with an easy-to-deploy path to liquid cooling for both new and legacy data centers.

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